Product Summary

The FDIP32W (window ceramic frit-seal package)
and LCCC32W (leadless chip carrier package)
have a transparent lids which allow the user to expose
the chip to ultraviolet light to erase the bit pattern.
A new pattern can then be written to the
device by following the programming procedure.

Image Part No Mfg Description Data Sheet Download Pricing
(USD)
Quantity
M27C2001-12F1
M27C2001-12F1

STMicroelectronics

EPROM 2M (256Kx8) 120ns

Data Sheet

Negotiable 
Image Part No Mfg Description Data Sheet Download Pricing
(USD)
Quantity
M27C1001-10B1
M27C1001-10B1

STMicroelectronics

EPROM 1M (128Kx8) 100ns

Data Sheet

Negotiable 
M27C1001-10C1
M27C1001-10C1

STMicroelectronics

EPROM 1M (128Kx8) 100ns

Data Sheet

Negotiable 
M27C1001-10C6
M27C1001-10C6

STMicroelectronics

EPROM OTP 1Mx8

Data Sheet

Negotiable 
M27C1001-10F1
M27C1001-10F1

STMicroelectronics

EPROM 1M (128Kx8) 100ns

Data Sheet

Negotiable 
M27C1001-12B1
M27C1001-12B1

STMicroelectronics

EPROM 1M (128Kx8) 120ns

Data Sheet

Negotiable 
M27C1001-12C1
M27C1001-12C1

STMicroelectronics

EPROM 1M (128Kx8) 120ns

Data Sheet

Negotiable