Product Summary
The FDIP32W (window ceramic frit-seal package)
and LCCC32W (leadless chip carrier package)
have a transparent lids which allow the user to expose
the chip to ultraviolet light to erase the bit pattern.
A new pattern can then be written to the
device by following the programming procedure.
Image | Part No | Mfg | Description | Pricing (USD) |
Quantity | |||||
---|---|---|---|---|---|---|---|---|---|---|
M27C2001-12F1 |
STMicroelectronics |
EPROM 2M (256Kx8) 120ns |
Data Sheet |
Negotiable |
|
|||||
Image | Part No | Mfg | Description | Pricing (USD) |
Quantity | |||||
M27C1001-10B1 |
STMicroelectronics |
EPROM 1M (128Kx8) 100ns |
Data Sheet |
Negotiable |
|
|||||
M27C1001-10C1 |
STMicroelectronics |
EPROM 1M (128Kx8) 100ns |
Data Sheet |
Negotiable |
|
|||||
M27C1001-10C6 |
STMicroelectronics |
EPROM OTP 1Mx8 |
Data Sheet |
Negotiable |
|
|||||
M27C1001-10F1 |
STMicroelectronics |
EPROM 1M (128Kx8) 100ns |
Data Sheet |
Negotiable |
|
|||||
M27C1001-12B1 |
STMicroelectronics |
EPROM 1M (128Kx8) 120ns |
Data Sheet |
Negotiable |
|
|||||
M27C1001-12C1 |
STMicroelectronics |
EPROM 1M (128Kx8) 120ns |
Data Sheet |
Negotiable |
|